发明名称 |
VERFAHREN ZUR HERSTELLUNG VON HÖCKER UND HALBLEITERANORDNUNG |
摘要 |
The presentinvention intends to form bumps of desired size and shape by simple steps. For this end, pads 2 are formed on a printed circuit board 1 at the same space as pads on a semiconductor chip 5. Then, the entire upper surface of the printed circuit board 1 is covered with a rsist 3 except pad formed areas. The surface of the printed circuit board 1 covered with the resist 3 is then oriented downwardly and is sprayed with molten solder from the bottom side. The molten solder attaches the pad formed surface on the printed cuircuit board 1 and ideal semispherical bumps 4 are formed by the influence of gravity. The printed circuit board 1 formed with the bumps 4 is aligned with the pads 6 on the semiconductor chip 5 to be transferred into a high temperature oven. The bumps 4 are molten for jointing the semiconductor chip 5 and the printed circuit board 1. <IMAGE> |
申请公布号 |
DE69737939(D1) |
申请公布日期 |
2007.08.30 |
申请号 |
DE1997637939 |
申请日期 |
1997.10.29 |
申请人 |
NIIGATA SEIMITSU CO. LTD. |
发明人 |
OKAMOTO, AKIRA |
分类号 |
H01L21/48;H01L21/60;H05K3/34 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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