| 摘要 |
<p>Production of a conducting strip (4) on a passivated substrate (1) comprises: applying a mask to the substrate; structuring the mask to form an opening corresponding to the conducting strip; providing a conducting strip in the opening on the substrate; removing the mask; and encasing the conducting strip using a metal-selective wet chemical dip coating method. An Independent claim is also included for a corrosion-protected conductor strip produced by the above process. Preferred Features: A diffusion barrier and/or short circuit layer is applied to the substrate before applying the mask. The diffusion barrier and/or short circuit layer is made from a metal layer, preferably titanium. A support layer (3) is applied on the substrate before the mask is applied.</p> |
