| 摘要 |
A SOCKET FOR CARRYING AN INTEGRATED CIRCUIT (IC) CHIP. THE SOCKET INCLUDES A PLURALITY OF OPPOSED CONTACTS WHICH HAVE UPPER AND LOWER INTEGRAL BEAMS. THE SOCKET ALSO INCLUDES A SPRING-BIASED MOVABLE TOP WITH INCLINED INNER SIDE WALLS TO URGE THE CONTACTS INTO A LATCHED POSITION WITH THE UPPER BEAM CONTACTING A LEAD OR A POD ON THE IC TO ESTABLISH ELECTRICAL CONTACT. AS THE TOP IS PUSHED DOWN, THE RESILIENT NATURE OF THE CONTACTS ALLOWS THE LOWER BEAM TO RIDE UP THE INCLINED SIDE WALL INTO AN UNLATCHED POSITION WHEREIN THE IC MAY BE REMOVED FROM THE SOCKET. |
