PLANARIZING APPARATUS AND PLANARIZING METHOD USING THE SAME

摘要

A planarizing apparatus and a planarizing method using the same are provided to perform a planarizing process by moving hard balls within an internal space of a chamber filled with a medium by using megasonic. A wafer chuck(210) is used for supporting a wafer(120). An internal space(230) is defined by an external wall(220) of a chamber and the wafer chuck. A planarizing process is performed in the internal space. A megasonic injection hole(240) is formed to supply megasonic into the internal space through the external wall of the chamber. The internal space is filled with a liquid medium. A plurality of hard balls are dipped into the liquid medium of the internal space. The liquid medium includes deionized water or diluted HF solution.