| 摘要 |
<p>The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit (6) mounted with a master tape formed with pickup position indication holes is fixed to an adjusting jig. A recognition camera (14) takes an image of a recognition mark to calculate a center position thereof, moves to a position corresponding to a component pickup position previously stored in a memory portion, and takes an image of the pickup position indication hole provided in the master tape to calculate a component pickup position. Data on a positional relationship between the recognition mark and the pickup position based on a result of this recognition processing are stored in a memory in the component feeding unit (6). The component feeding units (6) each mounted with a storage tape are fixed to a base (2) of an electronic component mounting apparatus (1). When an electronic component mounting operation is performed, a board recognition camera (17) takes an image of the recognition mark provided in the component feeding unit (6) to calculate a center position thereof, and the CPU corrects a pickup position of a suction nozzle (18) based on the pickup position data stored in the memory.
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