| 摘要 |
A flexible membrane is provided to reduce deformation or breakage of the flexible membrane caused due to friction between the flexible membrane and a wafer during chemical mechanical polishing. A flexible membrane(150) includes an approximately round wafer contact surface(152) which contacts a rear surface of a wafer(200) so as to apply pressure to the wafer; and an approximately round contact rear surface(154) positioned opposite to the wafer contact surface. The contact rear surface has a protrusion(160) having a height of 0.3 to 3mm. The protrusion is formed in the area of 0.5 to 50% of the total area of the contact rear surface. |
