发明名称 |
Multi-layered printed circuit board, and grid array package adopting the same |
摘要 |
In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit board, some or all of the plurality of power supply pins are connected to a power supply pattern via an inductance pattern, thereby reducing generation of radiation noise. <IMAGE> |
申请公布号 |
EP0766503(B1) |
申请公布日期 |
2007.07.18 |
申请号 |
EP19960115548 |
申请日期 |
1996.09.27 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
OHTAKI, TORU;ICHIDA, YASUTERU;TAKEUCHI, YASUSHI |
分类号 |
H05K1/02;H01L23/12;H01L23/64;H05K1/00;H05K1/16;H05K3/34;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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