发明名称 |
ELECTROFORM SPRING BUILT ON MANDREL TRANSFERABLE TO OTHER SURFACE |
摘要 |
<p>Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.</p> |
申请公布号 |
EP1807240(A2) |
申请公布日期 |
2007.07.18 |
申请号 |
EP20050812242 |
申请日期 |
2005.10.21 |
申请人 |
FORMFACTOR, INC. |
发明人 |
ELDRIDGE, BENJAMIN, N.;MATHIEU, GAETAN, L. |
分类号 |
B23P21/00;C23C18/16;C23C18/31;C25D1/10;C25D1/20;H05K3/40 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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