| 摘要 |
A first conductor having a surface formed with an Au layer is connected, via a Zn-containing solder, to a second conductor which is conductive at least at a surface thereof. The first conductor may be, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), whereas the second conductor may be a terminal (20a, 21a) of an electronic component (20, 21) or a terminal plate (22). The first conductor is connected to the second conductor via an Au-Zn alloy layer which is formed as a result of the diffusion of Zn from the Zn-containing solder into the Au layer of the first conductor. <IMAGE> |
