发明名称 SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor package including a wiring board having a semiconductor element and a component including an electronic component generating many electromagnetic waves, for inhibiting the generation of unnecessary electromagnetic waves. <P>SOLUTION: The semiconductor element 10 is mounted on the wiring board 1, and at least one connection electrically connected with a wire 4 on the board and dummy connections 11 and 12 not electrically connected with the wire are formed on the wiring board. Components (a second harmonic filter circuit 8, spiral circuits 5 and 6) which generate electromagnetic waves degrading distortion characteristics of the semiconductor element or other electronic components during the operation of the element 10 are formed on the wiring board. Electronic components 7 and 9 are connected with the connections of the wiring board; also an electromagnetic shielding metallic cap 13 for covering the components generating the electromagnetic waves are connected with the dummy connections; and a resin seal is formed for covering the semiconductor element, the electronic components, and the metallic cap. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007103566(A) 申请公布日期 2007.04.19
申请号 JP20050289861 申请日期 2005.10.03
申请人 TOSHIBA CORP 发明人 TAMURA KOJI;OKAMOTO TOSHIHIRO;ISHIHARA TOSHIYA;NAKAO JUNICHI;SUGIURA MASAYUKI;SASAKI FUMIO;MIWA MAMORU
分类号 H01L23/28 主分类号 H01L23/28
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