| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered printed circuit board which can improve a degree of freedom of conductor patterns. <P>SOLUTION: The multilayered printed circuit board 41 includes a second layer 52 whereon a first electronic component 81 is mounted, second conductor pattern 72 formed on the second layer 52, first layer 51 which incorporates the first electronic component 81 between the second layer 52 and itself, first conductor pattern 71 formed on the first layer, and second and third electronic components 82 and 83 having a conductivity which are incorporated between the second layer 52 and the first layer 51 and electrically connect the second conductor pattern 72 and the first conductor pattern 71. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
