| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper plating method in which the concentration of chlorine ion in a plating bath is lowered and stabilized even in continuous plating using a copper sulfate bath. SOLUTION: In the copper plating method using a copper material as an anode, a material to be plated as a cathode and the copper sulfate plating bath containing chlorine ion, chlorine ion in the copper sulfate plating bath 2 is converted to chlorine gas to be removed by actuating at least one insoluble electrode 11 which is independent of the anode, as an anode while brought into contact with the copper sulfate plating bath 2. The apparatus for electrolytically removing chlorine ion (2) comprises the insoluble electrode 11 directly dipped into the copper sulfate plating bath in a plating vessel 1 and the material to be plated 3b arranged in the plating vessel 1. COPYRIGHT: (C)2007,JPO&INPIT
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