| 摘要 |
The invention relates to a sensor module (1) whose first variant comprises a housing (2), at least one sensor element (10) arranged therein, a sealing body (15), which encompasses the sensor surface of the sensor element in such away the internal space of the housing (2) is sealed with respect to surroundings, and a socket piece (18) whose end is sealingly contacting the sealing body (15) and which communicates with the surroundings through a channel (17). The inventive sensor element (10) comprises a sensor housing (11) provided with a collar-shaped element (13), which encompasses the sensor surface, whose one end is superimposed on the socket piece (18) end, one of the ends thereof is immersed, at least partially, into the sealing body (15) made of a gel material and the other end forms an outer boundary for said sealing body (15). In a second variant, the sensor module (1) comprises a housing (50) and a sensor element (53) arranged therein on a circuit board (51). Said sensor element (53) is placed in such a way that it is not encompassed by a sensor housing with a sensor surface and is oriented towards the circuit board (51) (flip-chip) on the first main side thereof provided with a through hole (58) which connects the sensor surface with surroundings, wherein an underfill (59) is placed between the sensor element (53) and the first main side of the circuit board (51) in such a way that it encompasses the sensor surface and seals the internal space of the housing (50) with respect to surroundings. |
