| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a simple manufacturing process, and to provide a method of manufacturing the same. SOLUTION: The semiconductor device comprises a heat slinger equipped with a front surface and rear surface facing each other, a semiconductor device equipped with a front surface and rear surface which are fixed on the heat slinger and face each other, a lead fixed in a bonding region of the front surface of the semiconductor device with a bonding material, and an electrode terminal attached to the lead. A straight line passing the centroid of the lead intersects with the bonding region perpendicularly. Furthermore, a fixing process of fixing the lead to the bonding region of the front surface of the semiconductor device comprises the steps of arranging solder material in the bonding region, melting the solder material in the state that the lead is made to stand independently so that the lead may touch with the solder material, and fixing the lead in the bonding region. COPYRIGHT: (C)2007,JPO&INPIT |
