A method of thermoforming comprises the steps of providing a film, heating the film, and forming the heated film onto a mold. The film comprises a propylene/ethylene copolymer skin layer having a melting point of from about 130°C to about 150°C and an interior polyamide layer having a melting point of from about 125°C to about 230°C.
申请公布号
WO2007015789(A3)
申请公布日期
2007.04.19
申请号
WO2006US27590
申请日期
2006.07.17
申请人
CRYOVAC, INC.;HOFMEISTER, FRANK, M.;AYERS, BOBBY;MIRANDA, NATHANAEL, R.;PRICE, CINDY, T.
发明人
HOFMEISTER, FRANK, M.;AYERS, BOBBY;MIRANDA, NATHANAEL, R.;PRICE, CINDY, T.
