发明名称 |
Elektronisches Leistungssystem mit passiver Kühlung |
摘要 |
The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe. |
申请公布号 |
DE602004005126(D1) |
申请公布日期 |
2007.04.19 |
申请号 |
DE20046005126T |
申请日期 |
2004.10.20 |
申请人 |
DELPHI TECHNOLOGIES INC. |
发明人 |
OBERLIN, GARY E.;MYERS, BRUCE A.;DEGENKOLB, THOMAS A.;PEUGH, DARREL E. |
分类号 |
H05K7/20;H01L23/427 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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