COPPER-CLAD LAMINATE, PRINTED-WIRING BOARD, MULTI-LAYER PRINTED-WIRING BOARD AND METHODS FOR MANUFACTURING THESE COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminate which can significantly improve copper foil adhering strength (copper foil release strength) without a process to roughen or blacken the surface of a copper foil, and can be successfully used even in a high frequency range.

SOLUTION: This copper-clad laminate 101 is a copper-clad laminate for a single-side printed wiring board with the copper foil 4 bonded to one surface of an insulating substrate 2 constituted of a prepreg 2A made of a fluororesin through a composite film 3 of LCP and PFA. In addition, the copper foil 4 is a rolled copper foil with both surfaces which are smooth but not roughened or blackened. Further, the insulating substrate 2 and the copper foil 4 can be bonded together by calcining and pressurizing through the composite film 3 under such temperature conditions that the melting point is higher than that of PFA by 5 to 40°C and lower than that of LCP.

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