发明名称 |
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE, ELECTROOPTICAL DEVICE AND ELECTRONIC APPARATUS, AS WELL AS SEMICONDUCTOR DEVICE, ELECTROOPTICAL DEVICE AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To conduct forming so as to allow a channel length between the source-drain electrodes of a transistor to be short and uniform with the use of a simple method. SOLUTION: The source-drain electrodes 103 are formed on a glass substrate 101 with a front-end insulating film 102 formed on the surface. A coating film 104 is formed by coating an impurity-containing liquid silicon material between the source-drain electrodes. The coating film 104 is irradiated with a laser beam so as to remove a part of the film 104, and separated into a first coating film 106 and a second coating film 107. The first and second coating films 106, 107 are calcined to be n-type silicon films. A semiconductor film 110 is formed between the first n-type silicon film 108 and the second n-type silicon film 109. Then a gate insulating film 111 and a gate electrode 113 are successively formed on the semiconductor film 110. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007103626(A) |
申请公布日期 |
2007.04.19 |
申请号 |
JP20050290858 |
申请日期 |
2005.10.04 |
申请人 |
SEIKO EPSON CORP |
发明人 |
AOKI TAKASHI |
分类号 |
H01L21/336;H01L21/28;H01L29/786;H01L51/50 |
主分类号 |
H01L21/336 |
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