| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliable semiconductor laser device which can prevent electrical short caused by solder effluence when bonding with a submount from occurring without increasing manufacturing cost. SOLUTION: A groove 121 is arranged at a location overlapping with a groove 120 of n-type current block layer 106 in a second electrode layer 109 of the semiconductor laser device 11, and this groove 121 functions so that it can hold a part of solder material 110 oozing out when bonding the semiconductor laser device 11 to submount 111. Consequently, the amount of effluence of solder material 110 can be suppressed toward a height direction of side of a semiconductor laser device 11. COPYRIGHT: (C)2007,JPO&INPIT |
