发明名称 Device for liquid treatment of wafer-shaped articles
摘要 A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary force.
申请公布号 US2007084561(A1) 申请公布日期 2007.04.19
申请号 US20060584652 申请日期 2006.10.23
申请人 SEZ AG 发明人 ENGESSER PHILIPP
分类号 C23F1/00;H01L21/683;B05B7/00;B05C5/00;B05C15/00;H01L21/00;H01L21/304;H01L21/306 主分类号 C23F1/00
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