| 摘要 |
The present invention relates to a device for carrying out a surface treatment of substrates under vacuum, which comprises a housing ( 1 ) comprising chambers ( 2 - 5 ) communicate with a vacuum source, at least one of which chambers serves as vacuum lock to the remaining chambers when surface treatment processes are in progress. The housing ( 1 ) is divided into an upper and a lower housing half ( 6, 7 ) of which at least one has symmetrically distributed recesses ( 8 ). Pivotally mounted between the housing halves ( 6, 7 ) is a revolver ( 9 ), which comprises recesses ( 10 ) in which substrate to be treated is placed. The housing halves ( 6, 7 ) are designed to be in two positions, in the first of which they are separated from the revolver ( 9 ) and in the second of which they are in contact therewith. In the first position the revolver ( 9 ) is designed to be turned to predefined rotational positions at which recesses in the housing halves ( 6, 7 ) and the revolver ( 9 ) coincide in the chambers ( 2 - 5 ). In the first position the vacuum lock can be opened and evacuated without disturbing the vacuum in other parts of the housing ( 1 ).
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