| 摘要 |
An electronic circuit (10) can be produced by placing an electrically conductive compressible circuit bump (28) on a circuit electrode (32) of a mounting surface (20, 46) of first and second circuit devices (12, 38), such as an integrated circuit and a base substrate. One or more auxiliary bumps (40) can also be placed on one or both of the mounting surfaces (20, 46) of the circuit devices (12, 38). During mounting, the first circuit device (12) can be positioned over the second circuit device (38) with the circuit bumps (28) connecting circuit contacts (14, 32) on the two mounting surfaces (20, 46). Pressure can be applied so that the circuit bumps (28) and the auxiliary bumps (40) are compressed between the integrated circuit and the base device sufficiently for adhering at least the circuit bumps (28) to the circuit contacts (14, 32). |
