LEAD FRAME STRUCTURE FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A lead frame structure in a semiconductor package fabrication is provided to obtain an excellent molding plane from the semiconductor package by improving the flow of a mold material using a tie bar free mold gate side structure. A lead frame structure includes a side frame(16), a chip mounting plate(18) for mounting a semiconductor chip, and a plurality of leads(24) prolonged from the side frame to predetermined portions adjacent to sides of the chip mounting plate. The side frame and each corner of the chip mounting plate are connected with a plurality of tie bars(10b,10c,10d). At this time, the side frame and the chip mounting plate are free from the tie bar at a mold gate side.