Chemical mechanical polishing pad having secondary polishing medium capacity control grooves

摘要

A chemical mechanical polishing pad ( 104, 400 ) that includes a polishing layer ( 108, 420, 500 ) having a set of primary grooves ( 124, 408, 516 ) formed in a polishing surface ( 110, 428, 520 ) of the pad. The pad also includes a set of secondary grooves ( 128, 404, 504 ) that become selectively active as a function of the wear of the polishing layer from polishing.