发明名称 THIN FILM MEASURING APPARATUS, THIN FILM MEASURING METHOD AND THIN FILM MANUFACTURING METHOD
摘要 <p>A thin film measuring apparatus by which a minute current flowing in a measuring sample such as a semiconductor substrate is measured by probe irradiation of electron beams or the like and characteristics of a thin film such as a seed layer can be detected without destroying the sample. A thin film measuring method and a thin film manufacturing method are also provided. The thin film measuring apparatus is provided with a means for measuring a substrate current generated in the measuring sample when the measuring sample is irradiated with electron probe beams or the like. The thin film measuring apparatus is characterized in that the apparatus is provided with a means for measuring the characteristics of the thin film based on the substrate current in a status prior to forming the thin film on the measuring sample and the substrate current in a status after forming the thin film on the measuring sample.</p>
申请公布号 WO2006134662(A1) 申请公布日期 2006.12.21
申请号 WO2005JP11136 申请日期 2005.06.17
申请人 FAB SOLUTIONS, INC;YAMADA, KEIZO 发明人 YAMADA, KEIZO
分类号 G01B7/02;H01L21/66;G01B15/02;G01N23/225 主分类号 G01B7/02
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