HYBRID CONDUCTIVE COATING METHOD FOR ELECTRICAL BRIDGING CONNECTION OF RFID DIE CHIP TO COMPOSITE ANTENNA

摘要

A radio frequency identification device (RFID) includes a non-conductive first substrate, an integrated circuit device mounted to the carrier substrate and having at least one conductive terminal and a patterned conductive coating applied to the non-conductive substrate and in contact with the at least one conductive terminal. The patterned conductive coating includes a polymeric matrix and a conductive particulate filler, the polymeric matrix being capable of undergoing at least 2% deformation elastically and without significant change in the conductive properties of the patterned conductive coating serving as an antenna. The RFID can be fabricated by affixing an IC chip to a surface of a substrate having a patterned conductive coating and applying a bridging coating to connect terminals of the IC chip to the antenna.