发明名称 IC CARD AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC card capable of remarkably reducing the occurrence of both a damage of an IC chip caused by a bending stress of the card and a broken connection line between the IC chip and an antenna. <P>SOLUTION: To an antenna sheet 3, an IC chip 4 is bonded so as to form an antenna 3a being connected to the IC chip 4. On a core sheet 1, a loose fit hole 1a to loosely fit the antenna sheet 3 thereto is bored. Also, on an inlet sheet 2, an insertion hole 2a is bored for inserting the IC chip 4. By mounting the antenna sheet 3 loosely on the loose fit hole 1a, and by inserting the IC chip 4 into the insertion hole 2a, the core sheet 1 is overlapped with the inlet sheet 2. By arranging protection sheets on the respective outer faces of the core sheet 1 and the inlet sheet 2, a sheet laminate is formed and heat-bonded. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344084(A) 申请公布日期 2006.12.21
申请号 JP20050170244 申请日期 2005.06.10
申请人 HITACHI ENGINEERING & SERVICES CO LTD;LIVING SYSTEM INTERNATIONAL KK 发明人 MAKI KAZUHIRO;ONIYANAGI YOSHITATSU
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
代理机构 代理人
主权项
地址