| 摘要 |
PROBLEM TO BE SOLVED: To provide an attaching apparatus and an attaching method that are suitable for attaching an adhesive sheet, such as protective sheet onto an adherend, such as semiconductor wafer with the tension being suppressed minimally. SOLUTION: When a protective sheet T1 is to be attached to a wafer W as described below, the wafer W is held so that the attaching surface of the wafer W is faced out, and then the protective sheet T1 is let out so that the protective sheet T1 sags under own weight, and subsequently the protective sheet T1 that is let out is pressed and attached onto the held wafer W, while being kept pressurized. COPYRIGHT: (C)2007,JPO&INPIT |
