| 摘要 |
PROBLEM TO BE SOLVED: To uniformize in-plane temperature of a semiconductor wafer mounted on a wafer stage in a semiconductor manufacturing apparatus. SOLUTION: The semiconductor wafer 6 is mounted on a lower electrode 4, and a wafer placement surface of the lower electrode 4 and a rear surface of the semiconductor wafer 6 are brought into close surface contact by electrostatic adsorption. Further, a contact thermometer 13 inserted from a plurality of second openings 9 penetrating the lower electrode 4 is brought into contact with the rear surface of the semiconductor wafer 6. Temperatures at a plurality of positions on the rear surface of the semiconductor wafer 6 are individually measured by the contact thermometer 13, and information concerning the temperature of the semiconductor wafer 6 is transmitted to a controller 11 possessed by cooling gas piping 10 connected to a first opening 8 formed, paired with a second opening 9 for introducing cooling gas to the rear surface of the semiconductor wafer 6, and further pressure of the cooling gas is individually controlled by the controller 11 at a plurality of places. COPYRIGHT: (C)2007,JPO&INPIT |
