| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor test interface capable of minimizing the number of connector contact points to enhance signal integrity in a high-speed transmission signal, capable of simplifying a semiconductor test interface to enhance maintainability of a semiconductor testing device, and capable of easily dealing also with tests of DUTs different each other. SOLUTION: This semiconductor test interface includes a DUT board 320 provided with a test socket 315 for attaching the DUT, one or more of the first connector(s) 325 for electric connection to a cable 340, and circuit wiring for electric connection between the test socket 315 and the first connector(s) 325, and the cable 340 provided, in its both end parts, with the second connector 335 for electric connection to the the first connector(s) 325 and the third connector 345 for electric connection to a pin card 370. COPYRIGHT: (C)2007,JPO&INPIT
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