| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device reducing the test cost of a semiconductor device. SOLUTION: The inspection device has a tester board 12 capable of containing in a chamber, sockets 16 which are mounted in a plurality on the first main panel 12-1 of the tester board 12 and a test device 11 to be test object is loaded, a device test means 17 which is mounted in a plurality on the second main panel 12-2 of the tester board 13 and inputting specific test signals in the semiconductor device 11 and evaluating the semiconductor device 11 based on the output signal output from the semiconductor device 11 in accordance with the test signals, and a radiation base plate 21 for cooling the device test means 17. By heating the semiconductor device 11 loaded on the socket 16 in a chamber and cooling the device test means 17 with a radiation means 21, burn-in tests and characteristic tests of the semiconductor device 11 are performed. COPYRIGHT: (C)2007,JPO&INPIT
|
