SELECTIVELY GROOVED COLD PLATE FOR ELECTRONICS COOLING

摘要

An improved heat exchange device adaptable for cooling electronic components mounted over at least one external surface of the device, comprising a base plate (1); a cover plate (3) ; a clad sheet (2) interposed between the base plate (1) and the cover plate (3) the base plate (1) and the cover plate (3), with the clad sheet (2) being rigidly jointed to form a single integrated plate; at least one inlet port (5) and at least one outlet port (6) at one end and/or at the opposite ends of the formed plate for entry and exit of a cooling medium, characterized in that the base plate (1) is configured to have a plurality of flow-passages each comprising several machined grooves (4) having varied dimensions predetermined in registration with respective thermal footprint of the electronic components thereby optimizing the heat transfer rate, and in that a plurality of interconnections being designed between the grooves (4) constituting one of a series and parallel flow-paths .