HIGH FREQUENCY ELECTRONIC COMPONENT

摘要

[PROBLEMS] To provide a high frequency electronic component being thin but exhibiting mechanical strength being excellent in electric insulation characteristics, and being remarkably low in dielectric loss. [MEANS FOR SOLVING PROBLEMS] The high frequency electronic component comprises conductor wiring for transmitting an electric signal of 100 MHz-100 GHz, and an insulation layer composed of a thermoplastic resin film containing cavities oriented in at least one direction by drawing, characterized in that the thermoplastic resin film containing cavities contains 3-45 vol% of cavities, the number of layers of cavities existing in the thickness direction of the film is 5 or above, and the density of the number of layers of cavities being defined by the following expression is in the range of 0.1-10 pieces/µm. Density of the number of layers of cavities (pieces/µm) = the number of layers of cavities (pieces) in film thickness direction/film thickness (µm)