| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package which has a structure of excellent heat dissipation performance, and is manufactured with the small number of processes at low cost, and to provide its manufacturing method. <P>SOLUTION: In a substrate of the LED package, a heat dissipator is arranged at a central portion, and is exposed to an upper and a lower surfaces. An LED is fixed by a conductive adhesive agent to a bottom face of a cavity formed on the upper face of the heat dissipating portion, and the conductive adhesive agent and the heat dissipator constitute a heat dissipating path. A first electrode is exposed to an upper face at a periphery of the substrate, and is connected to the heat dissipator within the substrate. A second conductor is exposed to the upper face at the periphery of the substrate which is at an opposite side to the first electrode to form a second electrode. A nonconductor envelops a first conductor and the second conductor separately, and separates these each other. A transparent cap covers the upper face of the substrate, and seals the LED within the cavity of the heat dissipator. A lead wire is provided on the lower face of the cap, and one end of the wire is connected to the upper face of the LED, while the other end is connected to an exposed portion of the second electrode. <P>COPYRIGHT: (C)2007,JPO&INPIT |
