| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device, a plating treatment controller, a plating method and a plating treatment control method where potential during plating treatment can be monitored, and also, the ununiformity of a plating thickness in the substrate to be plated can be prevented. SOLUTION: In the electroplating device 10, a plating tank 2 filled with a plating liquid 3 is provided, the substrate 4 to be plated is used as a cathode electrode, the substrate 4 to be plated and an anode electrode 5 are dipped into the plating liquid 3 in a state of being confronted so as to be made almost parallel, and the substrate 4 to be plated is subjected to electroplating. The device is provided with a monitoring means for monitoring the balance of the change in potential at least between two points in the plating liquid 4. COPYRIGHT: (C)2007,JPO&INPIT
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