| 摘要 |
A polishing equipment includes a polishing head mounting thereon a wafer and a polishing pad having a polishing surface for polishing the wafer. The polishing surface has a groove for guiding slurry on the polishing surface. The groove has a depth larger in the intermediate area of the polishing surface than in the central area and peripheral area of the polishing surface, in consideration of a higher abrasion rate of the polishing surface in the intermediate area in which the polishing surface is abraded in a larger amount.
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