发明名称 THREE-DIMENSIONAL STRUCTURE TRANSFER METHOD AND APPARATUS
摘要 A method for transferring a three-dimensional structure onto a substrate, which includes filling a plurality of concaves arranged on a sheet-form mold with a paste-like structural material, temporarily fixing the mold to a support member, contact-bonding the structural material in a state in which the structural material has the adhesion property or bonding property to the substrate together with the mold, releasing the temporary fixation of the mold by the support member after the contact-bonding, and removing the mold from the substrate, thereby transferring a three-dimensional structure onto the substrate.
申请公布号 KR100660581(B1) 申请公布日期 2006.12.21
申请号 KR20000054277 申请日期 2000.09.15
申请人 发明人
分类号 H01J9/02;B29C31/00;B29C33/42;B29C37/00;B29C41/02;B41F17/14;B41M1/10;B44C3/02;H01J9/24;H01J11/22;H01J11/24;H01J11/34;H01J11/36 主分类号 H01J9/02
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