| 摘要 |
A laminated semiconductor package (500) includes: a first package (700) having: an insulating layer (701); a first semiconductor chip (715) embedded in the insulating layer (701); a wiring (703,705,707,709,704,706,708,710) connected to the first semiconductor chip; a first connecting section (702) which is formed on a first face side of the insulating layer and connected to the wiring; and a second connecting section (712) which is formed on a second face side of the insulating layer and connected to the wiring, the second face side being opposite to the first face side; and a second package (600) having: a second semiconductor chip (602); and a third connecting section (605) connected to the second semiconductor chip (602). In the laminated semiconductor package, the first package (700) and the second package (600) are laminated one on the other, and the second connecting section (712) and the third connecting section (605) are connected to each other. |
