INTEGRATED CIRCUIT PACKAGE AND INTEGRATED CIRCUIT MODULE

摘要

An IC package and an IC module are provided to secure an aiming reliability for a long time by stabilizing a connection state between a post pin and a land pin using a metal connection or a mechanical connection. An IC chip(321) is mounted on a substrate(311). A post pin(341) is formed on one surface of the substrate. The post pin is made of a first metallic material. The post pin is electrically connected with the IC chip. A land pin(351) is formed on the other surface of the substrate. The land pin is made of a second metallic material. The land pin is electrically connected with the IC chip. The land pin and the post pin are electrically connected with each other through a predetermined metal(361) of a via hole, wherein the via hole is formed through the substrate.