| 摘要 |
A cleaning apparatus for a polished semiconductor substrate is provided to clean the semiconductor substrate clearly by using a cleaning pad, thereby reducing a cleaning time. A cleaning apparatus includes a chuck table(220) supporting a semiconductor substrate, and a first cleaning unit(240) cleaning the semiconductor substrate on the chuck table. The first cleaning unit has a rotary mount and a cleaning pad attached on the mount for frictionally contacting with the semiconductor substrate. The cleaning pad of the first cleaning unit is a pad for polishing a mirror surface. The polished semiconductor substrate is polished by a second cleaning unit(230).
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