| 摘要 |
<p>A spin coating apparatus is provided to monitor easily a centering separation state of a wafer at an edge of the wafer by installing a position detection sensor, a display unit, and a CCD(Charge Coupled Device) camera around the edge of the wafer. A chuck(120) is used for supporting a wafer(130). A rotary shaft(110) is installed at a lower end of the chuck in order to rotate the chuck and the wafer. A position detection sensor(140) is installed apart from an edge of the wafer. A display unit displays a state of the wafer. The display unit is formed with a CCD camera(150). The display unit photographs the state of the wafer according to an output of the position detection sensor when a gap between the edge of the wafer and the position detection sensor is changed.</p> |
