发明名称 |
Method, system, and apparatus for transfer of integrated circuit dies using an attractive force |
摘要 |
A method, system, and apparatus for transferring integrated circuit dies is described. A die receptacle structure has a first surface. The first surface has a plurality of cells formed therein. Each cell is configured to contain an integrated circuit die. A bottom surface of each cell is configured to attract dies having a first material thereon. Example forces that can be used to attract dies into cells include a magnetic force, a chemical force, and an electrostatic force.
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申请公布号 |
US2006223225(A1) |
申请公布日期 |
2006.10.05 |
申请号 |
US20050091528 |
申请日期 |
2005.03.29 |
申请人 |
SYMBOL TECHNOLOGIES, INC. |
发明人 |
ARNESON MICHAEL R.;BANDY WILLIAM R. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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