摘要 |
A pretreatment composition for treating a substrate to be subjected to forming a relief pattern thereon by exposure to actinic radiation, the pretreatment composition comprising: (a) at least one compound having Structure (VI), wherein, V is selected from CH and N, Y is selected from O and NR<SUP>3</SUP> wherein R<SUP>3</SUP> is selected from H, CH<SUB>3</SUB> and C<SUB>2</SUB>H<SUB>5</SUB>, R<SUP>1</SUP> and R<SUP>2</SUP> are each independently selected from H, a C<SUB>1</SUB> - C<SUB>4</SUB> alkyl group, a C<SUB>1</SUB> - C<SUB>4</SUB> alkoxy group, cyclopentyl and cyclohexyl, or alternatively, R<SUP>1</SUP> and R<SUP>2</SUP> can be fused to produce a substituted or unsubstituted benzene ring, with the proviso that the substituent is not an electron withdrawing group, (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure (VI) present in the composition effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate. Processes for pretreatment of substrates and processes for forming relief images on pretreated substrates are disclosed. |
申请人 |
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.;POWELL, DAVID B.;NAIINI, AHMAD A.;METIVIER, N. JON;PERRY, DONALD F. |
发明人 |
POWELL, DAVID B.;NAIINI, AHMAD A.;METIVIER, N. JON;PERRY, DONALD F. |