| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device having an optical axial position(optical axial height) suitable for electronic equipment to be mounted, a method for manufacturing the optical semiconductor device, and electronic equipment loaded with the optical semiconductor device. <P>SOLUTION: A light emitting element chip 2, an IC chip 3, and a light receiving chip 4 are loaded on a first surface 1f of a wiring board 1; translucent resin is ejected(injected) from a runner 15 to the direction of a resin flow RF; and a resin molding part 5 for sealing and a dummy resin molding part 6 in parallel with this are formed by carrying out resin formation. A connection terminal 16 is formed corresponding to the dummy resin molding part 6 on a second surface 1s. The dummy resin molding part 6 is diced by a dicing line DL, and a resin molding part 7 is formed for mounting having a substrate terminal 1a for mounting vertically crossing the first surface 1f (second surface 1s) and a resin terminal 7a for mounting configuring the same plane as the substrate terminal 1a for mounting. <P>COPYRIGHT: (C)2007,JPO&INPIT |
