| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a crack on a part that covers a wiring pattern out of the surface-protective film even under an action by the thermal stress in a semiconductor device having a bump on a pad at the end of the wiring pattern with the wiring pattern covered by the surface-protective film. <P>SOLUTION: The pads 15a, 16a at the end of the aluminum wiring pattern have the bumps on them, and the aluminum wiring patterns 15, 16 are covered by the surface-protective film 18. A plurality of slits 21 are formed on the surface-protective film. The plurality of slits are arranged so as to surround the pads 15a, 16a at the part except the part with the aluminum wiring patterns 15, 16 existing. When cracks occur, they occur in the part of the dimension S between the adjacent slits. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
