发明名称 DIFFUSION BONDING METHOD FOR METAL
摘要 PROBLEM TO BE SOLVED: To provide a method for bonding metals of a different hardness, the method by which a large bonding strength can be obtained. SOLUTION: The diffusion bonding method is used for bonding a first member 110 formed using a first metal and a second member 120 formed using a second metal that has a higher harness than the first metal. The method comprises a process of removing an oxidized film formed at least on one bonding face by sliding the bonding face 112 of the first member and that 126 of the second member, and a process of bonding the first and second members by making an electric current flow between them while imparting a pressing force thereto. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006263809(A) 申请公布日期 2006.10.05
申请号 JP20050203048 申请日期 2005.07.12
申请人 ORIGIN ELECTRIC CO LTD 发明人 SASAKI KOJI
分类号 B23K20/00;B23K20/22;B23K103/20 主分类号 B23K20/00
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