| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor device for preventing burr to be generated on the inner surface of an opening formed at a substrate by router working, and for preventing sealing resin leakage from a metallic mold when resin sealing is carried out. SOLUTION: This substrate for a semiconductor device is provided with an opening part 12 formed in the neighborhood of the central part of a substrate 10, a pad 22 for bonding wire-bonded to an electrode terminal 14a of a loaded semiconductor element 14, and a pad 26 for external connection terminal mounted with an external connection terminal 18 electrically connected to the pad for bonding by a conductor pattern. The opening is formed by router working in the neighborhood of the substrate covered with a solder resist layer, and a solder resist layer 30a covering the substrate surface between the peripheral edge of the opening and the pad for bonding is made thinner than a solder resist layer 30b to which metallic mold 34 for resin-sealing the opening and the pad for bonding is butted. COPYRIGHT: (C)2007,JPO&INPIT
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