| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor and a lead frame used therefor which prevents a conductive adhesive from protruding to the mounting surface, and improves its connection reliability in connection of a capacitor element layer to a cathode terminal with a conductive adhesive. SOLUTION: The chip type solid electrolytic capacitor is of a downside electrode type. In the capacitor, a connection of a cathode terminal 15 and a cathode layer of a capacitor element 11 is composed of a top end 19 formed by thinly crushing the top end of a lead frame and a crosstie-like protrusion 16, the top end 19 is connected to the cathode layer of the capacitor element 11 on the mounting side with a conductive adhesive 17, and the crosstie-like protrusion 16 has an approximately vertical surface which is approximately vertical to the mounting surface and faces the side of the capacitor element 11. The approximately vertical surface is connected to the cathode layer of the capacitor element 11, and has a groove 23a for storing the conductive adhesive 17. A groove or recess may be formed in the upside of the top end 19. COPYRIGHT: (C)2007,JPO&INPIT
|
