发明名称 METHOD OF MANUFACTURING MULTILAYERED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered ceramic electronic component which can improve an yield by reducing the occurrence of failures in a laminate cutting process. SOLUTION: The method of manufacturing a multilayered ceramic electronic component comprises a sheet manufacturing process, a laminate manufacturing process, and a laminate piece manufacturing process. In the laminate manufacturing process, cutting marks 43 are formed on the surface of a third green sheet 43 whose relative positional deviation in a direction crossing the stacking direction has the largest impact on the characteristics of the multilayered ceramic electronic component, under a state that five green sheets 4a-4e are stacked in the form of a laminate 3. In the sheet manufacturing process, windows 42 are formed in a fourth and a fifth green sheets 4d and 4e which are above the third green sheet 4c at such regions as to face the cutting marks 43. In the laminate piece manufacturing process, the laminate 3 is cut along the cutting lines indicated by the cutting marks 43 exposed on the surface of the laminate 3 through the windows 42. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269549(A) 申请公布日期 2006.10.05
申请号 JP20050082483 申请日期 2005.03.22
申请人 SANYO ELECTRIC CO LTD 发明人 NOGUCHI HITOSHI
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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