| 摘要 |
<P>PROBLEM TO BE SOLVED: To find defects in stages preceding to a grinding stage in an early stage in a wafer process as to a method for manufacturing a semiconductor device which includes a stage of grinding a thin film of a material different from a ground thin film by a CMP method. <P>SOLUTION: Processing times of all wafers in a log in the grinding stage using the CMP method are measured and the difference between a maximum value and a minimum value among the processing times is calculated and compared with a set difference value. When the calculated value is larger than the set value, it is determined that the lot includes an abnormal wafer for which a stage preceding to the grinding stage is not properly performed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
